Modeling and Control of Time-pressure Dispensing for Semiconductor Manufacturing

To improve the consistency of the adhesive amount dispensed by the time-pressure dispenser for semiconductor manu- facturing,a non-Newtonian fluid flow rate model is developed to represent and estimate the adhesive amount dispensed in each cycle. Taking account of gas compressibility,an intelligent model-based control strategy is proposed to compensate the deviation of adhesive amount dispensed from the desired one.Both simulations and experiments show that the dispensing consistency is greatly improved by using the model-based control strategy developed in this paper.